The dynamic centrifugal separation ensures barrier-free separation of grinding media from materials with smooth discharge and the minimum size of grinding beads being 0.03mm to which makes grinding of materials below 100nm possible.
Applications
Si-C Anode Materials, Nano-TiO2, MLCC, Ink Jet, Buffing and Polishing Materials, and other nano materials, etc.
Advantages
- No separation screen needed, smooth discharge
- Narrow and even particle distribution
- The minimum size of grinding beads can be 0.03mm
- Ultra-fine nano grinding below 100nm